TX automatic solder paste printer is a product aimed at the-high-end application of SMT, especially for precision boards of 01005 or below, it has better molding and soldering volume. It can be placed back to back or used by a single machine. Printing range is 510mmx510mm.
With CE Certificate/ Award Certificate/ Software work Certificate/ Software ework Certificat/ Certificate of Authorization.
Technical Parameters:
| PCB boarding Handling Paramater | |
| Max. board Size(X x Y) | 510mm x 510mm |
| Min. board Size(X x Y) | 50mm x 50mm |
| PCB thickness Range | 0.4mm~6mm |
| PCB Warpage | ≤1%Diagonal |
| Max. board weight | 3Kg |
| PCB edge clearance | Configuration to 3mm |
| PCB bottom clearance | 20mm |
| Conveyor speed (Max.) | 1500mm/s(Max) |
| Conveyor height | 900±40mm |
| Conveyor direction | L-R,R-L,L-L,R-R |
| Transfer mode | One stage Conveyor |
| PCB Clamping method | Automatic adjustment of PCB thickness + Programmable elastic side clamp (Option:1.Edge locking base plate pressing;2.Bottom integral cavity vacuum; 3.Bottom multi-point local vacuum) |
| Support method | Magnetic thimble + Equal high block.(Optional:1.vacuum suction cavity;2.special workpiece fixture) |
| Printing parameters | |
| Printing head | Floating intelligent printing head (two independent direct connected motors) |
| Stencil frame size | 470mm x 370mm~737 mm x 737 mm |
| Max. printing area(X x Y) | 510mm x 510mm |
| Squeegee Material/Angle | Steel squeegee/ Rubber squeegee
(Angel 45°/50°/60° matching the printing process) |
| Squeegee length | 300mm+520mm(optional with length of 200mm-550mm) |
| Squeegee height | 65±1mm |
| Squeegee thickness | 0.25mm Diamond-like carbon coating |
| Print mode | Single or dual squeegee printing |
| Demoulding length | 0.02 mm – 12 mm |
| Print speed | 0 ~ 200 mm/s |
| Print pressure | 0.5kg – 10Kg |
| Print stroke | ±275 mm(From the center) |
| Cleaning parameters | |
| Cleaning system | 1.Programmable washer fluid injection system; 2. Dry, wet and vacuum modes |
| Length of cleaning and wiping board | 380mm+500mm(optional with 300mm, 450mm) |
| Optical System | |
| Field of view | 8mm x 6mm |
| Printing table adjustment range | X:±5.0mm,Y:±7.0mm,θ:±2.0° |
| Fiducial Types | Standard Fiducial type(Circle, triangle, square, diamond, cross)(SMEMA standard),solder pad/openings |
| Vision methodology | Independent camera,upwards/downwards imaging vision system,
geometric matching location |
| Performance parameters | |
| Machine Alignment repeatability | ±10.0μm @6 σ,Cpk ≥ 2.0 |
| Full process repeatability | ±15.0μm @6 σ,Cpk ≥ 2.0 |
| Core Cycle time | 7.5s(Exclude printing and cleaning) |
| Product Changeover Time | <5min |
| Equipment | |
| Power supply | AC220V±10%,50/60HZ,15A |
| Air supply | 4~6Kg/cm² |
| Air Consumption | About 5L/min |
| Operating system (OS) | Windows XP (Option Win 7 & WIN10) |
| External dimension | 1220mm(L) x1480mm(W) x 1530mm(H)(Without light,monitor and keyboard) |
| Machine weight | Appro.1150Kg |
| User Permission | Different users have different permissions
(fingerprint identification entering / password input) |
| Environment temperature | 23±3°C |
| Relative humidity | 45~70%RH4 |
Standard Configuration:
| 1. Accurate optical positioning system Adjustable four light sources, light intensity is adjustable,light is uniform, and image acquisition is more perfect; Good identification (including uneven mark points), apply for tinning,copper plating, Gold plating,tin spraying,FPC and other types of PCB with different colors. 2. High efficiency and high adaptability stencil cleaning system 3. Printing axis servo drive 4. Intelligent squeegee system 5. Simple and reliable PCB positioning system 6. 2D solder paste printing quality inspection and SPC analysis |
Available Options Configuration:
|
1. Automatic solder paste filling function Regular and fixed point automatic addition of solder paste,to ensure the quality of solder paste and the amount of solder paste in the stencil. In order to ensure that the customer can carry out the quality of stable and continuous printing for a long time, improve productivity. Can be real-time monitoring the roll diameter of the solder paste on screen trigger automatically add functionality 2. Detection function of solder paste margin of stencil 3. Detection functionof Stencil plugging 4. Automatic dispensing function 5. Squeegee pressure close-loop feedback control 6. Temperature and humidity control function 7. Magnetic squeegee 8. Vacuum suction plate and upperpress function 9. Support MES system seamless docking 10. SPI online function interface |
Other Available options Configuration:
| Item No. | Function |
| 1 | Paste Roll Height Monitor (aPRHM) |
| 2 | Internal temperature and humidity detection on the work area |
| 3 | Window 10 system |
| 4 | Upper Press Function |
| 5 | PCB Size 525 mm * 350 mm |
| 6 | PCB board support method Grid-Lock |
| 7 | Support pins or support block detection sensor |
| 8 | Squeegee holder |
| 9 | System of adding solder paste from cartridge Semko 6 Oz |
| 10 | Control – by touch screen monitor |
| 11 | PC must have (SSD) |
| 12 | Range of adjustment feets from 45 to 160 mm |
| 13 | 6.1 Software can save log-files 6. 2 Log-files contain data about all possible parameters of the equipment 6.3 Discreetness of data saving may be set up without limits 6.4 Export of log-files to Excel or Access 6.5 Alarm system in case of parameters are not correspond to preset parameters 6.6 Possibility of remote export of log files 6.7 For all parameters of the equipment there will be possibility of setting up of critical value of such parameters and further actions (means stoppage or further work with indication and information in separate log-file) with marks in log-files only in case of preset parameters will go beyond critical value. |
| 14 | UPS |
