World best super precision full 3D AOI
– Non-blind spot digital 12 projection moiré 3D inspection technology
– Inspection for diffused reflection component, OCR, micro crack precisely by 8 phases coaxial color lighting
– Smallest component inspection by 25Megapixel 7.7㎛ CXP main camera
– High resolution 18 mega pixel angled camera system
Hybrid Inspection: Best yield with combination of full 3D inspeciton, full 2D insepction and deep learning algorithm
Multi-Vision® : simultaneous 5-dimension inspeciton by using 18 mega pixel angled cameras
Intellisys® : Total process management system for improving productivity and achieving smart factory
One-Click Programming : simple and easy programming by using IPC international standard library
Powerful 3D AOI which can be applied to SMT production line and second process of semiconductor manufacturing
Configuration |
Inline
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Types |
3D
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