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– Small component inspection up to 0201(㎜) size with high resolution 18 mega pixel CXP camera & 7.3㎛ lens
– Inspection for reflective objects, OCR, and crack precisely by 8 phases coaxial color light
– Super high resolution 18 mega pixel angled camera
– Lifted IC lead and BGA package inspection by laser unit
Configuration | Inline |
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Types | 2D |