MS-15 SeriesPrecision 3D SP for second process of semiconductor manufacturing

The world’s best performance 3D SPI

– Super high resolution CXP camera and precision 6㎛ lens
– Solder paste inspection up to 0201(㎜) size component pad
– 30㎛ height solder paste inspection
– Shadow-free dual projection 3D measurement
– High accuracy and repeatability with linear motor drive system

Auto PCB warpage compensation

Closed-Loop System : Optimize the manufacturing process by connection with Screen Printer and Pick & Place Machine

Intellisys® : Total process management system for improving productivity and achieving smart factory

High precision 3D SPI that can be applied to solder paste inspection of semiconductor second process, mini-LED and micro-LED