The automated visual inspection of PCB manufacturing uses a camera to scan the assembly for defects.
Automated Optical instection (AOI) can be used at every stages through the manufacturing process: including bare board, solder paste inspection (SPI machine) and board inspection before reflow oven and/or after reflow oven.
These systems are more and more important nowadays for manufacturers because they provide incomparable reliability to quality control of boards with thousands of solder joints and components.
SPI moving forward to 3D because of shadow problems at 2D technologies that were used to collect a solder deposit image.
The 3D SPI machine and 3D AOI machine together provides manufacturers to accurately control and monitor processes via software logging and statistic reports.
