Registration is open for October 11-12, 2022, at the Kimpton Hotel Monaco in Washington, the first IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem. Focusing on the opportunities and challenges for next-generation advanced packaging production process, the IPC Advanced Packaging Symposium offers in-depth discussions on strengthening the IC-substrate and package assembly ecosystem across North America and Europe region.

IPC chief technologist Matt Kelly said “Fundamental changes in the semiconductor sector are impacting the electronics manufacturing supply chain, and lines are blurring between IC-substrate and printed circuit board fabrication and between semiconductor and electronics assembly. Understanding these industry changes will ensure the emergence of innovative, well-balanced, and resilient ecosystems to support the production of the most cutting-edge semiconductor components.”

The two-day event with three keynotes, 28 speakers and eight sessions will bring commercial and defense electronic industry leaders together to focus on high-priority needs for IC-substrates and packaging, to identify key challenges to overcome, enabling sustainable businesses over the long run, to move past general issue awareness into actionable research, development, design, and business operations execution and to provide attendees with actionable next steps and an expanded network for continued development efforts.

Speakers that span the advanced packaging ecosystem and semiconductor supply chain: component makers, HDI PCB fabricators, market-leading IC-Substrate fabricators, assembly and test manufacturers, equipment, and material suppliers. Three keynotes from main senior leaders at Intel, Department of Defense, and TechSearch International. An eight-session agenda includes the latest insights from the main spheres as Department of Commerce, Department of Defense, European Commission, Intel, NIST, Northrop Grumman, Raytheon, Schweizer Electronic, SEMCO, SkyWater, TechSearch International, TTM, and Western Digital among others.