SMT Screen Printer /Solder Paste Printing Machine — KOREAN SMT SOLUTIONS

SMT high precision stencil printer for production line

ArtnevPro — Thu, 16 Dec 2021 09:12:36 +0000

Technical Parameters

PCB parameters
Maximum board size(X x Y)	450mm x 350mm
Minimum board size(Y x X)	50mm x 50mm
PCB thickness	0.4mm~6mm
PCB Warpage	Max. PCB ≤1%Diagonal
Maximum board weight	6Kg
Board margin gap	Configuration to 3mm
Maximum bottom gap	20mm
Transfer speed	1500mm/s(Max)
Transfer height from the ground	900±40mm
Transfer orbit direction	Left-Right,Right-Left,Left-Left,Right-Right
Transfer mode	One stage orbit
PCB damping method	Programmable elastic side clamp + Automatic adjustment PCB thickness+ Edge locking and pressing PCB (Option:1.Bottom inte gral cavity type vacuum;2.Bottom multi-point local vacuum)
Support method	Magnetic thimble + Equal high block.(Optional:1.vacuum suction cavity; 2.special workpiece fixture)
Printing parameters
Printing head	Floating intelligent printing head ( two independent direct connected motors)
Template frame size	470mm x 370mm~737 mm x 737 mm
Maximum printing area(X x Y)	450mm x 350mm
Squegee type	Steel squeegee/Rubber squeegee(Angle 45°/50°/60° matching the printing process)
Squegee length	220mm~ 500mm
Squegee height	65±1mm
Squegee thickness	0.25mm Diamond-like carbon coating
Printing mode	Single or double scraper printing
Demoulding length	0.02 mm – 12 mm
Printing speed	0 ~ 200 mm/s
Printing pressure	0.5kg – 10Kg
Printing stroke	±200 mm (From the center)
Image parameters
Field of view	6.4mm x 4.8mm
Platform adjustment range	X.Y:±7.0mm,θ:±2.0°
Fiducial Types	S t and ar d Fiducial type( Circle, triangle, square, diamond, cross) (SMEMA standard), solder pad/ openings
Vision System	Independent camera,upwards/downwards imaging vision system,geometric matching location
Performance parameters
Repetition precision of image calibration	±10.0micron @6 σ,Cpk ≥ 2.0
Repetition precision of printing	±20.0micron @6 σ,Cpk ≥ 2.0
Cycle time	<7s
Product changeover	<5mins
Equipment
Power supply	AC220V±10%,50/60HZ,15A
Air supply	4~6Kg/cm2, 10.0 Diameter of the tube
Gas consumption	About 5L/min
Operating system	Windows XP
External dimension	1140mm(L) x 1415mm(W) x 1480mm(H)(Excluding tricolor lamp,monitor and keyboard)
Machine weight	Around 1000Kg
Temperature and humidity control module(optional)
Environment temperature	23±3˚C
Relative humidity	45-70%RH4

Standard Configuration:

2. High efficiency and high adaptability stencil cleaning systemThe new wiping system ensures full contact with the stencil ; three cleaning methods of dry, wet and vacuum, and free combination can be selected; soft wear-resistant rubber wiping plate, thorough cleaning, convenient disassembly, and universal length of wiping paper.
3. Intelligent squeegee systemIntelligent programmable setting, two independent direct motors driven squeegee, built-in precise pressure control system.
4.HTGD Special PCB thickness adaptive system

The platform height is automatically calibrated according to PCB thickness setting, which is intelligent, fast, simple and reliable in structure.

5. Simple and reliable PCB positioning systemProgrammable elastic side clamp and magnetic supporting device.

6. 2D solder paste printing quality inspection and SPC analysis

2D function for offset, less tin, leakage, tin connection and other printing problems can be quickly detected, the detection point arbitrary increase; The SPC software can analyze the samples collected by the machine CPK index ensures printing quality.

Available Options Configuration:

1. Automatic solder paste filling function
Regular and fixed point automatic addition of solder paste,to ensure the quality of solder paste and the amount of solder paste in the stencil. In order to ensure that the customer can carry out the quality of stable and continuous printing for a long time, improve productivity.
It can be real-time monitoring the roll diameter of the solder paste on screen trigger automatically add functionality

2. Detection function of solder paste margin of stencil
Real time detection of solder paste margin (thickness) on stencil,intelligent prompt for tin filling

3. Detection functionof Stencil plugging
By compensating the light source above the stencil, CCD is used to check the mesh in real time,so as to quickly detect and judge whether the stencil is blocked after cleaning,and carry out automatic cleaning, which is a supplement to the 2D detection of PCB.

4. Automatic dispensing function
According to different printing process requirements, PCB can be accurately dispensing tin,line drawing,filing and other functional operations after printing.

5. Squeegee pressure close-loop feedback control
Built in precise digital pressure sensor control system, through the squeegee pressure feedback system, it can accurately display the original pressure value of the squeegee,intelligently adjust the depth of the squeegee pressure,ensure the constant pressure value inthe printing process and obtain the highest process control, and realize the perfect printing of high-density and fine spacing devices.

6. Temperature and humidity control function
Automatic regulation and supervision of temperature and humidity in the printing press to ensure the stable physical characteristics of printing Materials.

7. Magnetic squeegee
Magnetic adsorption squeegee blade,instead of screw hole positioning mode, convenient and quick replacement.

8. Vacuum suction plate and upperpress function
It can automatically clamp PCB of various sizes and thicknesses to effectively overcome the deformation of the board,Make sure that the tin is evenly printed.

9. Support MES system seamless docking
It can scan the 1D code 2D code on the customer PCB and record the relevant information.which can be shared with the customer MES system. MES system uses 2D code,1D code, mobile IOT and other technologies to conduct scientific management on the warehouse material preparation and prevention, incoming material picking management, material loading and error prevention,production scheduling,quality traceability,Kanban control,etc. in the SMT production process. Through the optimization process to improve the production efficiency,improve product quality,shorten the production cycle, reduce the manufacturing cost,to achieve a comprehensive and scientific traceability management,to help enterprises quickly respond to market changes, improve the core competitiveness.

10. SPI online function interface
A closed-oop system is formed by connecting with SPI.After receiving feedback information of defective SPI printing, the machine will automatically adjust the offset according to SPI feedback. The XY offset can be adjusted automatically within 3PC.and clean the stencil, improve the printing quality and production efficiency,constitute a complete printing feedback system.

Other Available options Configuration:

Item No.	Function
1	Paste Roll Height Monitor (aPRHM)
2	Internal temperature and humidity detection on the work area
3	Window 10 system
4	Upper Press Function
5	PCB Size 525 mm * 350 mm
6	PCB board support method Grid-Lock
7	Support pins or support block detection sensor
8	Squeegee holder
9	System of adding solder paste from cartridge Semko 6 Oz
10	Control – by touch screen monitor
11	PC must have (SSD)
12	Range of adjustment feets from 45 to 160 mm
13	6.1 Software can save log-files 6. 2 Log-files contain data about all possible parameters of the equipment 6.3 Discreetness of data saving may be set up without limits 6.4 Export of log-files to Excel or Access 6.5 Alarm system in case of parameters are not correspond to preset parameters 6.6 Possibility of remote export of log files 6.7 For all parameters of the equipment there will be possibility of setting up of critical value of such parameters and further actions (means stoppage or further work with indication and information in separate log-file) with marks in log-files only in case of preset parameters will go beyond critical value.
14	UPS

DX automatic solder paste printing machine

ArtnevPro — Thu, 16 Dec 2021 09:12:36 +0000

DX Fully Automatic Solder Paste Printer is a product aimed at the high-end application of SMT,especially for precision boards of 01005 or below, it has better molding and soldering volume. It can be placed back to back or used by a single machine. Printing range is 510mmx510mm.

Alignment precision∶±10.0micron/μm@6σ,Cp≥2.0
Printing precision∶ ±15.0micron/μm@6σ,Cp≥2.0

Technical Parameters:

PCB boarding Handling Paramater
Max. board Size(X x Y)	510mm x 510mm
Min. board Size(X x Y)	50mm x 50mm
PCB thickness Range:	0.4mm~6mm
PCB Warpage	≤1%Diagonal
Max. board weight	3Kg
PCB edge clearance	Configuration to 3mm
PCB bottom clearance	20mm
Conveyor speed (Max.)	1500mm/s(Max)
Conveyor height	900±40mm
Conveyor direction	L-R,R-L,L-L,R-R
Transfer mode	One stage Conveyor
PCB Clamping method	Automatic adjustment of PCB thickness + Programmable elastic side clamp + Edge locking base plate pressing + Bottom integral cavity vacuum (Option: Bottom multi-point local vacuum)
Support method	Magnetic thimble + Equal high block.(Optional:1.vacuum suction cavity;2.special workpiece fixture)
Printing parameters
Print head	Floating intelligent printing head (two independent direct connected motors)
Stencil frame size	470mm x 370mm~737 mm x 737 mm
Max. printing area(X x Y)	510mm x 510mm
Squeegee Material/Angle	Steel squeegee/ Rubber squeegee(Angel 45°/50°/60° matching the printing process)
Squeegee length	300mm+520mm(optional with length of 200mm-550mm)
Squeegee height	65±1mm
Squeegee thickness	0.25mm Diamond-like carbon coating
Print mode	Single or dual squeegee printing
Demoulding length	0.02 mm – 12 mm
Print speed	0 ~ 200 mm/s
Print pressure	0.5kg – 10Kg
Print stroke	±275 mm(From the center)
Cleaning parameters
Cleaning system	1. Programmable washer fluid injection system; 2. Dry, wet and vacuum modes
Length of cleaning and wiping board	380mm,500mm(optional with 300mm, 450mm)
Optical System
Field of view	8mm x 6mm
Printing table adjustment range	X:±5.0mm,Y:±7.0mm,θ:±2.0°
Fiducial Types	Standard Fiducial type(Circle, triangle, square, diamond, cross)(SMEMA standard),solder pad/openings
Vision methodology	Independent camera,upwards/downwards imaging vision system,geometric matching location
Performance parameters
Machine Alignment repeatability	±10.0μm @6 σ,Cpk ≥ 2.0
Full process repeatability	±15.0μm @6 σ,Cpk ≥ 2.0
Core Cycle time	7.5s (Exclude printing and cleaning)
Product Changeover Time	<5min
Equipment
Power supply	AC220V±10%,50/60HZ,15A
Air supply	4~6Kg/cm²
Air Consumption	About 5L/min
Operating system (OS)	Windows XP (Option Win 7 & WIN10)
External dimension	1220mm(L) x1480mm(W) x 1530mm(H)(Without light,monitor and keyboard)
Machine weight	Appro.1230Kg
User Permission	Different users have different permissions (fingerprint identification entering / password input)
Environment temperature	23±3°C
Relative humidity	45~70%RH4

Standard Configuration:

1. Accurate optical positioning system
Adjustable four light sources, light intensity is adjustable,light is uniform, and image acquisition is more perfect; Good identification(including uneven mark points), apply for tinning, copper plating, Gold plating, tin spraying,FPC and other types of PCB with different colors.2. High efficiency and high adaptability stencil cleaning system
The new wiping system ensures full contact with the stencil and large vacuum suction,Ensure to eliminate the solder paste in the mesh,create an anti-static stick roller, and completely remove the solder paste adsorbed in the stencil and mesh truly realizes the effective automatic cleaning function.3. Printing axis servo drive
The Squeegee Y axis servo with screw drive,higher accuracy,more stable operation, extend the service life,to provide a good printing control platform for customers

4. Intelligent squeegee system
Intelligent programmable setting, two independent direct motors driven squeegee, built-in precise zero pressure detection system.

5. HTGD Special PCB thickness adaptive system
The platform height is automatically calibrated according to PCB thickness setting,which is intelligent, fast, simple and reliable in structure.

6. 2D solder paste printing quality inspection and SPC analysis
2D function for offset,less tin, leakage,tin connection and other printing problems can be quickly detected, the detection point arbitrary increase;The SPC software can analyze the samples collected by the machine CPK index ensures printing quality.

7. Automatic solder paste filling function
Regular and fixed point automatic addition of solder paste,to ensure the quality of solder paste and the amount of solder paste in the stencil. In order to ensure that the customer can carry out the quality of stable and continuous printing for a long time, improve productivity.8. Squeegee pressure close-loop feedback control
Built in precise digital pressure sensor control system, through the squeegee pressure feedback system, it can accurately display the original pressure value of the squeegee,intelligently adjust the depth of the squeegee pressure,ensure the constant pressure value in the printing process and obtain the highest process control, and realize the perfect printing of high-density and fine spacing devices.9. Temperature and humidity controlfunction
Automatic regulation and supervision of temperature and humidity in the printing press to ensure the stable physical characteristics of printing Materials.

10.Vacuum suction plate and upper press function
It can automatically clamp PCB of various sizes and thicknesses to effectively overcome the deformation of the board,Make sure that the tin is evenly printed.

11. Detection function of solder paste margin of stencil
Real time detection of solder paste margin (thickness) on stencil,intelligent prompt for tin filling

12. Detection function of Stencil plugging
By compensating the light source above the stencil, CCD is used to check the mesh in realtime,so as to quickly detect and judge whether the stencil is blocked after cleaning,and carry out automatic cleaning, which is a supplement to the 2D detection of PCB.

Available Options Configuration:

1. Automatic dispensing function
According to different printing process requirements,PCB can be accurately dispensing, tin, line drawing,filling and other functional operations after printing.2. Magnetic squeegee
Magnetic adsorption squeegee blade,instead of screw hole positioning mode, convenient and quick replacement.3. SPI online
A closed-loop system is formed by connecting with SPI. After receiving feedback information of defective SPI printing,the machine will automatically adjust the offset according to SPI feedback.The XY offset can be adjusted automatically within 3PC. and clean the stencil, improve the printing quality and production efficiency, constitute a complete printing feedback system.

4. Support MES system seamless docking
It can scan the 1D code 2D code on the customer PCB and record the relevant information, which can be shared with the customer MES system.MES system uses 2D code,1Dcode.mobile IOT and other technologies to conduct scientific management on the warehouse material preparation and prevention,incoming material picking management,material loading and error prevention, production scheduling, quality traceability, Kanban control,etc. in the SMT production process. Through the optimization process to improve the production efficiency,improve product quality,shorten the production cycle, reduce the manufacturing cost,to achieve a comprehensive and scientific traceability management,to help enterprises quickly respond to market changes, improve the core competitiveness.

Other Available options Configuration:

Item No.	Function
1	Paste Roll Height Monitor (aPRHM)
2	Internal temperature and humidity detection on the work area
3	Window 10 system
4	Upper Press Function
5	PCB Size 525 mm * 350 mm
6	PCB board support method Grid-Lock
7	Support pins or support block detection sensor
8	Squeegee holder
9	System of adding solder paste from cartridge Semko 6 Oz
10	Control – by touch screen monitor
11	PC must have (SSD)
12	Range of adjustment feets from 45 to 160 mm
13	6.1 Software can save log-files 6. 2 Log-files contain data about all possible parameters of the equipment 6.3 Discreetness of data saving may be set up without limits 6.4 Export of log-files to Excel or Access 6.5 Alarm system in case of parameters are not correspond to preset parameters 6.6 Possibility of remote export of log files 6.7 For all parameters of the equipment there will be possibility of setting up of critical value of such parameters and further actions (means stoppage or further work with indication and information in separate log-file) with marks in log-files only in case of preset parameters will go beyond critical value.
14	UPS

TX automatic solder paste printer

ArtnevPro — Thu, 16 Dec 2021 09:11:11 +0000

TX automatic solder paste printer is a product aimed at the-high-end application of SMT, especially for precision boards of 01005 or below, it has better molding and soldering volume. It can be placed back to back or used by a single machine. Printing range is 510mmx510mm.

With CE Certificate/ Award Certificate/ Software work Certificate/ Software ework Certificat/ Certificate of Authorization.

Technical Parameters:

PCB boarding Handling Paramater
Max. board Size(X x Y)	510mm x 510mm
Min. board Size(X x Y)	50mm x 50mm
PCB thickness Range	0.4mm~6mm
PCB Warpage	≤1%Diagonal
Max. board weight	3Kg
PCB edge clearance	Configuration to 3mm
PCB bottom clearance	20mm
Conveyor speed (Max.)	1500mm/s(Max)
Conveyor height	900±40mm
Conveyor direction	L-R,R-L,L-L,R-R
Transfer mode	One stage Conveyor
PCB Clamping method	Automatic adjustment of PCB thickness + Programmable elastic side clamp (Option:1.Edge locking base plate pressing;2.Bottom integral cavity vacuum; 3.Bottom multi-point local vacuum)
Support method	Magnetic thimble + Equal high block.(Optional:1.vacuum suction cavity;2.special workpiece fixture)
Printing parameters
Printing head	Floating intelligent printing head (two independent direct connected motors)
Stencil frame size	470mm x 370mm~737 mm x 737 mm
Max. printing area(X x Y)	510mm x 510mm
Squeegee Material/Angle	Steel squeegee/ Rubber squeegee (Angel 45°/50°/60° matching the printing process)
Squeegee length	300mm+520mm(optional with length of 200mm-550mm)
Squeegee height	65±1mm
Squeegee thickness	0.25mm Diamond-like carbon coating
Print mode	Single or dual squeegee printing
Demoulding length	0.02 mm – 12 mm
Print speed	0 ~ 200 mm/s
Print pressure	0.5kg – 10Kg
Print stroke	±275 mm(From the center)
Cleaning parameters
Cleaning system	1.Programmable washer fluid injection system; 2. Dry, wet and vacuum modes
Length of cleaning and wiping board	380mm+500mm(optional with 300mm, 450mm)
Optical System
Field of view	8mm x 6mm
Printing table adjustment range	X:±5.0mm,Y:±7.0mm,θ:±2.0°
Fiducial Types	Standard Fiducial type(Circle, triangle, square, diamond, cross)(SMEMA standard),solder pad/openings
Vision methodology	Independent camera,upwards/downwards imaging vision system, geometric matching location
Performance parameters
Machine Alignment repeatability	±10.0μm @6 σ,Cpk ≥ 2.0
Full process repeatability	±15.0μm @6 σ,Cpk ≥ 2.0
Core Cycle time	7.5s(Exclude printing and cleaning)
Product Changeover Time	<5min
Equipment
Power supply	AC220V±10%,50/60HZ,15A
Air supply	4~6Kg/cm²
Air Consumption	About 5L/min
Operating system (OS)	Windows XP (Option Win 7 & WIN10)
External dimension	1220mm(L) x1480mm(W) x 1530mm(H)(Without light,monitor and keyboard)
Machine weight	Appro.1150Kg
User Permission	Different users have different permissions (fingerprint identification entering / password input)
Environment temperature	23±3°C
Relative humidity	45~70%RH4

Standard Configuration:

2. High efficiency and high adaptability stencil cleaning system
The new wiping system ensures full contact with the stencil and large vacuum suction,Ensure to eliminate the solder paste in the mesh, create an anti-static stick roller,and completely remove The solder paste adsorbed in the stencil and mesh truly realizes the effective automatic cleaning function.

3. Printing axis servo drive
Squeegee Y axis servo with screw drive, higher accuracy, more stable operation, extended service life provides a good printing control platform for customers.

4. Intelligent squeegee system
Intelligent programmable setting, two independent direct motors driven squeegee, built-in precise zero pressure detection system.

5. Simple and reliable PCB positioning system
The platform height is automatically calibrate d according to PCB thickness setting, which is intelligent, fast,simple and reliable in structure.

6. 2D solder paste printing quality inspection and SPC analysis
2D function for offset, less tin, leakage, tin connection and other printing problems can be quickly detected,the detection point arbitrary increase;The SPC software can analyze the samples collected by the machine CPK index ensures printing quality.

Available Options Configuration:

1. Automatic solder paste filling function
Regular and fixed point automatic addition of solder paste,to ensure the quality of solder paste and the amount of solder paste in the stencil. In order to ensure that the customer can carry out the quality of stable and continuous printing for a long time, improve productivity.
Can be real-time monitoring the roll diameter of the solder paste on screen trigger automatically add functionality

2. Detection function of solder paste margin of stencil
Real time detection of solder paste margin (thickness) on stencil,intelligent prompt for tin filling

4. Automatic dispensing function
According to different printing process requirements, PCB can be accurately dispensing tin,line drawing,filing and other functional operations after printing.

7. Magnetic squeegee
Magnetic adsorption squeegee blade,instead of screw hole positioning mode, convenient and quick replacement.

Other Available options Configuration:

Item No.	Function
1	Paste Roll Height Monitor (aPRHM)
2	Internal temperature and humidity detection on the work area
3	Window 10 system
4	Upper Press Function
5	PCB Size 525 mm * 350 mm
6	PCB board support method Grid-Lock
7	Support pins or support block detection sensor
8	Squeegee holder
9	System of adding solder paste from cartridge Semko 6 Oz
10	Control – by touch screen monitor
11	PC must have (SSD)
12	Range of adjustment feets from 45 to 160 mm
13	6.1 Software can save log-files 6. 2 Log-files contain data about all possible parameters of the equipment 6.3 Discreetness of data saving may be set up without limits 6.4 Export of log-files to Excel or Access 6.5 Alarm system in case of parameters are not correspond to preset parameters 6.6 Possibility of remote export of log files 6.7 For all parameters of the equipment there will be possibility of setting up of critical value of such parameters and further actions (means stoppage or further work with indication and information in separate log-file) with marks in log-files only in case of preset parameters will go beyond critical value.
14	UPS

Screen Printer HP-350MD

ArtnevPro — Thu, 16 Dec 2021 09:10:59 +0000

항목	HP-520S	HP-680S	HP-850S	HP-1000S
Total System Alignment Accuracy and Repeatability	2.0CPK@±12.5um, 6-Sigma / ±0.0125mm
Printing Alignment Accuracy and Repeatability	2.0CPK@±25um, 6-Sigma / ±0.025mm
Cycle time (203L X 145W mm PCB)	ExcludingPrinting 7sec *Real Time 약 13sec	ExcludingPrinting 10sec *Real Time 약 16sec	ExcludingPrinting 12sec *Real Time 약 28sec	ExcludingPrinting 20sec *Real Time 약 28sec
Stencil Frame Size (Standard, L x W mm)	600 x 550 650 x 550, 736 x 736	650, 736, 800, 860 x 550, 736, 800	736,800,860,920,1000 ,1050 x 736, 800, 850	920,1000,1100,1200 x 800, 900
PCB Size(L x W mm)	50 x 50 ~ 520 x 420	50 x 50 ~ 680 x 510	50x 50 ~ 850 x 510	200×150 ~ 940 x 610
Print Area (L x W mm)	50 x 50 ~ 520 x 420	50 x 50 ~ 680 x 510	50x 50 ~ 850 x 510	200×150 ~ 940 x 610
PCB Thickness	0.3 ~ 6.5mm
PCB Weight	2 kg	5 kg	8 kg	10 kg
PCB Warpage	0 ~ 4mm (IncThickness)
PCB Stopper	Program에 의해 자동으로 Camera가 이동하여 정확한 위치에서 Board를 정지시킴
PCB Support	마그네틱Support Pin & Block / PCB “t”에 따른 높이 자동조절 / Support Pin 높이: 73.9mm Vacuum Type 지지 가능(OPTION) / Auto Support Pin 사용 가능(OPTION)
PCB Clamping	Top Link Clamping (0.8 ~ 6t) / Top Knife Clamping (0.2 ~0.8t) / Vacuum Type(OPTION)
PCB Under Clearance	30mm
기판측면(Edge) 허용범위	Top Link Clamping: 제한 없음 / Top Knife Edge Clamping: 3mm / Vacuum Type: 제한 없음
Conveyor 폭 조절	Program (Automatic) / In, Work, Out 3 Stage Conveyor (3단)
PCB 이송방향	좌 =>우, 우=>좌 (전면 기준, Standard)
Squeegee Type	Metal (스테인레스 합금강) 0.2t, 0.3t / Etching Blade, 다양한 Blade 종류/ User 선택사양
Squeegee Level method	Self-Balancing
Squeegee Speed	1 ~ 150mm/sec (Inc 0.1mm/sec)
Squeegee Pressure	Load-Cell 적용, 0.1 ~ 50kg/f (program)
Snap-off	Distance: 0 ~ 5.0mm (Inc 0.01mm) / Speed: 1 ~ 150mm/sec (Inc 0.01mm/sec)
Vision Camera	Interfaced Scan CCD *F.O.V 11mm x 8mm
Vision Board	EURESYS LIBRARY 적용
2D Inspection	Paste On Pad – 미납 검출 (Standard)
Fiducials (인식마크)	Register Figure Matching, Pattern Matching
Fiducials Size	0.4 ~ 5.0mm
Cleaning System	IPA + Paper + Vacuum Control을 Program Parameter에서 사용
Dimension(mm)	1530(L)x1635(W)x1457(H)	1750(L)x1735(W)x1457(H)	1910(L)x1750(W)x1457(H)	1950(L)x1945(W)x1457(H)
Machine Weight	1,360 kg	1,500 kg	1,650 kg	1,800 kg
Machine Power	AC 220V, 50/60Hz, 6.0KW
Pneumatic (Air)	0.5MPa, 40NL/min
운영 Program	산업용 PC, Microsoft Windows, LCD Monitor 17”
Host Communication	SMEMA Interface(Standard), TCP/IP(OPTION)

Screen Printer HP-520SPI

ArtnevPro — Thu, 16 Dec 2021 09:10:59 +0000

항목	HP-520S	HP-680S	HP-850S	HP-1000S
Total System Alignment Accuracy and Repeatability	2.0CPK@±12.5um, 6-Sigma / ±0.0125mm
Printing Alignment Accuracy and Repeatability	2.0CPK@±25um, 6-Sigma / ±0.025mm
Cycle time (203L X 145W mm PCB)	ExcludingPrinting 7sec *Real Time 약 13sec	ExcludingPrinting 10sec *Real Time 약 16sec	ExcludingPrinting 12sec *Real Time 약 28sec	ExcludingPrinting 20sec *Real Time 약 28sec
Stencil Frame Size (Standard, L x W mm)	600 x 550 650 x 550, 736 x 736	650, 736, 800, 860 x 550, 736, 800	736,800,860,920,1000 ,1050 x 736, 800, 850	920,1000,1100,1200 x 800, 900
PCB Size(L x W mm)	50 x 50 ~ 520 x 420	50 x 50 ~ 680 x 510	50x 50 ~ 850 x 510	200×150 ~ 940 x 610
Print Area (L x W mm)	50 x 50 ~ 520 x 420	50 x 50 ~ 680 x 510	50x 50 ~ 850 x 510	200×150 ~ 940 x 610
PCB Thickness	0.3 ~ 6.5mm
PCB Weight	2 kg	5 kg	8 kg	10 kg
PCB Warpage	0 ~ 4mm (IncThickness)
PCB Stopper	Program에 의해 자동으로 Camera가 이동하여 정확한 위치에서 Board를 정지시킴
PCB Support	마그네틱Support Pin & Block / PCB “t”에 따른 높이 자동조절 / Support Pin 높이: 73.9mm Vacuum Type 지지 가능(OPTION) / Auto Support Pin 사용 가능(OPTION)
PCB Clamping	Top Link Clamping (0.8 ~ 6t) / Top Knife Clamping (0.2 ~0.8t) / Vacuum Type(OPTION)
PCB Under Clearance	30mm
기판측면(Edge) 허용범위	Top Link Clamping: 제한 없음 / Top Knife Edge Clamping: 3mm / Vacuum Type: 제한 없음
Conveyor 폭 조절	Program (Automatic) / In, Work, Out 3 Stage Conveyor (3단)
PCB 이송방향	좌 =>우, 우=>좌 (전면 기준, Standard)
Squeegee Type	Metal (스테인레스 합금강) 0.2t, 0.3t / Etching Blade, 다양한 Blade 종류/ User 선택사양
Squeegee Level method	Self-Balancing
Squeegee Speed	1 ~ 150mm/sec (Inc 0.1mm/sec)
Squeegee Pressure	Load-Cell 적용, 0.1 ~ 50kg/f (program)
Snap-off	Distance: 0 ~ 5.0mm (Inc 0.01mm) / Speed: 1 ~ 150mm/sec (Inc 0.01mm/sec)
Vision Camera	Interfaced Scan CCD *F.O.V 11mm x 8mm
Vision Board	EURESYS LIBRARY 적용
2D Inspection	Paste On Pad – 미납 검출 (Standard)
Fiducials (인식마크)	Register Figure Matching, Pattern Matching
Fiducials Size	0.4 ~ 5.0mm
Cleaning System	IPA + Paper + Vacuum Control을 Program Parameter에서 사용
Dimension(mm)	1530(L)x1635(W)x1457(H)	1750(L)x1735(W)x1457(H)	1910(L)x1750(W)x1457(H)	1950(L)x1945(W)x1457(H)
Machine Weight	1,360 kg	1,500 kg	1,650 kg	1,800 kg
Machine Power	AC 220V, 50/60Hz, 6.0KW
Pneumatic (Air)	0.5MPa, 40NL/min
운영 Program	산업용 PC, Microsoft Windows, LCD Monitor 17”
Host Communication	SMEMA Interface(Standard), TCP/IP(OPTION)

Screen Printer HP-850S

ArtnevPro — Thu, 16 Dec 2021 09:10:59 +0000

항목	HP-520S	HP-680S	HP-850S	HP-1000S
Total System Alignment Accuracy and Repeatability	2.0CPK@±12.5um, 6-Sigma / ±0.0125mm
Printing Alignment Accuracy and Repeatability	2.0CPK@±25um, 6-Sigma / ±0.025mm
Cycle time (203L X 145W mm PCB)	ExcludingPrinting 7sec *Real Time 약 13sec	ExcludingPrinting 10sec *Real Time 약 16sec	ExcludingPrinting 12sec *Real Time 약 28sec	ExcludingPrinting 20sec *Real Time 약 28sec
Stencil Frame Size (Standard, L x W mm)	600 x 550 650 x 550, 736 x 736	650, 736, 800, 860 x 550, 736, 800	736,800,860,920,1000 ,1050 x 736, 800, 850	920,1000,1100,1200 x 800, 900
PCB Size(L x W mm)	50 x 50 ~ 520 x 420	50 x 50 ~ 680 x 510	50x 50 ~ 850 x 510	200×150 ~ 940 x 610
Print Area (L x W mm)	50 x 50 ~ 520 x 420	50 x 50 ~ 680 x 510	50x 50 ~ 850 x 510	200×150 ~ 940 x 610
PCB Thickness	0.3 ~ 6.5mm
PCB Weight	2 kg	5 kg	8 kg	10 kg
PCB Warpage	0 ~ 4mm (IncThickness)
PCB Stopper	Program에 의해 자동으로 Camera가 이동하여 정확한 위치에서 Board를 정지시킴
PCB Support	마그네틱Support Pin & Block / PCB “t”에 따른 높이 자동조절 / Support Pin 높이: 73.9mm Vacuum Type 지지 가능(OPTION) / Auto Support Pin 사용 가능(OPTION)
PCB Clamping	Top Link Clamping (0.8 ~ 6t) / Top Knife Clamping (0.2 ~0.8t) / Vacuum Type(OPTION)
PCB Under Clearance	30mm
기판측면(Edge) 허용범위	Top Link Clamping: 제한 없음 / Top Knife Edge Clamping: 3mm / Vacuum Type: 제한 없음
Conveyor 폭 조절	Program (Automatic) / In, Work, Out 3 Stage Conveyor (3단)
PCB 이송방향	좌 =>우, 우=>좌 (전면 기준, Standard)
Squeegee Type	Metal (스테인레스 합금강) 0.2t, 0.3t / Etching Blade, 다양한 Blade 종류/ User 선택사양
Squeegee Level method	Self-Balancing
Squeegee Speed	1 ~ 150mm/sec (Inc 0.1mm/sec)
Squeegee Pressure	Load-Cell 적용, 0.1 ~ 50kg/f (program)
Snap-off	Distance: 0 ~ 5.0mm (Inc 0.01mm) / Speed: 1 ~ 150mm/sec (Inc 0.01mm/sec)
Vision Camera	Interfaced Scan CCD *F.O.V 11mm x 8mm
Vision Board	EURESYS LIBRARY 적용
2D Inspection	Paste On Pad – 미납 검출 (Standard)
Fiducials (인식마크)	Register Figure Matching, Pattern Matching
Fiducials Size	0.4 ~ 5.0mm
Cleaning System	IPA + Paper + Vacuum Control을 Program Parameter에서 사용
Dimension(mm)	1530(L)x1635(W)x1457(H)	1750(L)x1735(W)x1457(H)	1910(L)x1750(W)x1457(H)	1950(L)x1945(W)x1457(H)
Machine Weight	1,360 kg	1,500 kg	1,650 kg	1,800 kg
Machine Power	AC 220V, 50/60Hz, 6.0KW
Pneumatic (Air)	0.5MPa, 40NL/min
운영 Program	산업용 PC, Microsoft Windows, LCD Monitor 17”
Host Communication	SMEMA Interface(Standard), TCP/IP(OPTION)