– Non-blind spot digital 12 projection moiré 3D inspection technology
– Inspection for diffused reflection component, OCR, micro crack precisely by 8 phases coaxial color lighting
– Smallest component inspection by 25Megapixel 7.7㎛ CXP main camera
– High resolution 18 mega pixel angled camera system

Hybrid Inspection: Best yield with combination of full 3D inspeciton, full 2D insepction and deep learning algorithm

Multi-Vision® : simultaneous 5-dimension inspeciton by using 18 mega pixel angled cameras

Intellisys® : Total process management system for improving productivity and achieving smart factory

One-Click Programming : simple and easy programming by using IPC international standard library

Powerful 3D AOI which can be applied to SMT production line and second process of semiconductor manufacturing

– Non-blind spot digital 12 projection moiré 3D inspection technology
– Inspection for reflective objects, OCR, and crack defect precisely by 8 phase coaxial color light
– Smallest component inspection by ultra-high resolution camera and lens
– 18 mega pixel angled camera which has similar resolution with main camera

Hybrid Inspection: Best yield with combination of full 3D inspeciton, full 2D insepction and deep learning algorithm

Multi-Vision® : simultaneous 5-dimension inspeciton by using 18 mega pixel angled cameras

Intellisys® : Total process management system for improving productivity and achieving smart factory

One-Click Programming : simple and easy programming by using IPC international standard library

The best performance at reasonable price

– Non-blind spot digital 12 projection moiré 3D inspection technology
– Inspection for diffuse reflection component, OCR, micro crack precisely by 8 phases coaxial color lighting
– Smallest component inspection by ultra-high resolution camera and lens
– 18 mega pixel angled camera which has similar resolution with main camera

Hybrid Inspection: Best yield with combination of full 3D inspeciton, full 2D insepction and deep learning algorithm

Multi-Vision® : simultaneous 5-dimension inspeciton by using 18 mega pixel angled cameras

Intellisys® : Total process management system for improving productivity and achieving smart factory

One-Click Programming : simple and easy programming by using IPC international standard library

Good design for space efficiency.

– Small component inspection up to 0201(㎜) size with high resolution 18 mega pixel CXP camera & 7.3㎛ lens
– Inspection for reflective objects, OCR, and crack precisely by 8 phases coaxial color light
– Super high resolution 18 mega pixel angled camera
– Lifted IC lead and BGA package inspection by laser unit

Multi-Vision® : simultaneous 5-dimension inspeciton by using 18 mega pixel angled camera

Intellisys® : Total process management system for improving productivity and achieving smart factory

Simple and easy auto programming using IPC international standard library

Reliable 2D AOI system that verified by 15,000 users

– Inspection for diffuse reflection component, OCR, micro crack precisely by 8 phases coaxial color lighting
– Angled camera system for solder inspection under J-lead, no-lead and coil component
– Lifted BGA package and CSP package inspection by laser unit

Multi-Vision® : simultaneous 5-dimension(Center, East, West, South, North) inspeciton by 18 mega pixel angled cameras

Intellisys® : Total process management system for improving productivity and achieving smart factory

Simple and easy auto programming using IPC international standard library

Benchtop 2D AOI system meets outstanding performance, economy and space utilization

– Super high resolution CXP camera and precision 6㎛ lens
– Solder paste inspection up to 0201(㎜) size component pad
– 30㎛ height solder paste inspection
– Shadow-free dual projection 3D measurement
– High accuracy and repeatability with linear motor drive system

Auto PCB warpage compensation

Closed-Loop System : Optimize the manufacturing process by connection with Screen Printer and Pick & Place Machine

Intellisys® : Total process management system for improving productivity and achieving smart factory

High precision 3D SPI that can be applied to solder paste inspection of semiconductor second process, mini-LED and micro-LED

– Super high resolution CXP camera and precision 6㎛ lens
– Solder paste inspection up to 0201(㎜) size component pad
– High accuracy & repeatability
– Shadow-free dual projection 3D measurement
– Various camera line-up from high-performance 25 mega pixel to economical 4 mega pixel

Auto PCB warpage compensation

Closed-Loop System : Optimize the manufacturing process by connection with Screen Printer and Pick & Place Machine

Intellisys® : Total process management system for improving productivity and achieving smart factory

Standard 3D AOI for various manuracturing process