2. Middle Production Line for SMD Assembling
Total solutions for surface mount technology (SMT)
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The line equipment is capable of assembling PCBs up to 510 x 420 mm with speed up to 118 000 CPH (Optimum*).
Quality control of product assembled in the line occurs in 2 stages: after solder paste printing and on the last assembly stage, after reflowing in the oven.
Solder paste application in printer is controlled by built-in 3D control system.
An optical inspection system programmed for testing of ready product is located after the reflow oven as well.
Additional software enables preparing PCB assembly program in offline mode.
It is possible to changeover the line for a new product in a few minutes using intellectual feeders and trolley feeder bases.
